The world’s most reliable liquid metal thermal interface material (TIM)
Based on proprietary liquid metal island‑type dispersion network patented technology, this material is a high‑performance polymer composite designed for extreme‑environment electronics. It delivers ultra‑low thermal resistance, high thermal conductivity, structural stability, and long‑term reliability for high‑power chips.
About Us
Founded in October 2021, Hubei HeatFlow Advanced Materials Co., Ltd. is a high-tech enterprise dedicated to the R&D, production, and sales of cutting-edge thermal management materials. With our R&D center in Hangzhou and a specialized production base in Chibi, Hubei, we bridge the gap between world-class scientific research and industrial-scale manufacturing.
Our core mission is to push the boundaries of thermal management through innovation. We specialize in HGF® High Thermal Conductivity Materials, HPT™ Thermal Interface Materials, and Integrated Thermal Management Systems.
Our Scientific Core
Our Product Portfolio
HGF® Graphene Films & Modules
High Performance: Industry-leading thermal diffusivity (50% higher than traditional materials).
Extreme Flexibility: Capable of withstanding 500,000 bends, making it ideal for foldable electronics and irregular spaces.
HPT™ Thermal Interface Materials (TIM)
Our HPT™ series offers high-performance alternatives to global industry leaders (DuPont, Laird, Shin-Etsu).
Liquid Metal Thermal Paste: Delivers ultra-high conductivity (10-16W/m·K) and ultra-low Bond Line Thickness (BLT <50μm) without metal precipitation.
Graphene Thermal Pads: Optimized for high-power GPUs, featuring superior elastic recovery and aging stability.
Specialty Adhesives & Gels: Including room-temperature curing glues and anti-cracking thermal gels.
Advanced Functional Materials
Electromagnetic Shielding (HPS): High-performance shielding (≥100dB) for harsh environments.
Wave Absorbing Materials (HPA): Ultra-thin, broadband absorption (2-40GHz) for aerospace and 5G communications.
Why Choose HeatFlow?
Key Application Areas
We provide customized, integrated thermal solutions for high-stakes industries:
New Energy Vehicles (EV): Battery thermal runoff protection and motor cooling.
Mobile Intelligence & Consumer Electronics: Cooling for high-performance chips, GPUs, and smartphones.
Data Centers & Servers: High-power server thermal management.
Aerospace & Defense: Space-grade copper-carbon welding technology for satellites and engine insulation.
Why Choose HeatFlow
Leading R&D: Backed by 50+ PhDs and Postdocs from top-tier research institutions.
Mass Production Capability: High-efficiency production lines with costs optimized for large-scale industrial adoption.
Proven Reliability: Trusted by industry giants like Honor, Xiaomi, Foxconn, VOYAH, and CRRC.
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Get in Touch
Building 39, Meili Health Industry Park, Zhonghuopu Town, Chibi City,Xianning City, Hubei Province,
China.
- +86 13600438860
- [email protected]
- Zhonghuopuzhen