HPT™ Thermal Interface Materials (TIM)
Our HPT™ series offers high-performance alternatives to global industry leaders (DuPont, Laird, Shin-Etsu).
Liquid Metal Thermal Paste: Delivers ultra-high conductivity (10-16W/m·K) and ultra-low Bond Line Thickness (BLT <15μm) without metal precipitation.
Graphene Thermal Pads: Optimized for high-power GPUs, featuring superior elastic recovery and aging stability.
Specialty Adhesives & Gels: Including room-temperature curing glues and anti-cracking thermal gels.
Reliability Testing
All tests completed over full cycles with no performance degradation:
- High‑temperature aging: 125 °C, 1000 hours
- High temp & high humidity: 85 °C / 85% RH, 1000 hours
- Thermal shock: −40 °C ↔ 125 °C, 1000 cycles
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Applications
- Server CPUs
- Desktop & laptop CPUs
- GPUs & high‑end graphics cards
- Game consoles
- Network & communication equipment
- SoC & ASIC chips
Graphene High Thermal Conductivity Flexible Module
Adopts aerospace-grade copper-carbon welding technology:Capable of meeting the requirements for durability and stability in extreme space environmentsHas been in orbit operation on multiple satellite models
LIQUID METAL TIM HPT-006-PCM
Liquid Metal Thermal Paste: Delivers ultra-high conductivity (6-8W/m·K) and ultra-low Bond Line Thickness (BLT <50μm) without metal precipitation. Graphene Thermal Pads: Optimized for high-power GPUs, featuring superior elastic recovery and aging stability. Specialty Adhesives & Gels: Including room-temperature curing glues and anti-cracking thermal gels.
HGF® Graphene Thermal Conductive Film
Thermal conductivity: ＞1900 W/(m·K) Thickness: 17–300 μm Operating temperature: -50℃ to 400℃ In roll form
LIQUID METAL TIM HPT-010-PCM
Liquid Metal Thermal Paste: Delivers ultra-high conductivity (10-12W/m·K) and ultra-low Bond Line Thickness (BLT <50μm) without metal precipitation. Graphene Thermal Pads: Optimized for high-power GPUs, featuring superior elastic recovery and aging stability. Specialty Adhesives & Gels: Including room-temperature curing glues and anti-cracking thermal gels.
Vertical High Thermal Conductivity Pad
Thermal conductivity: ＞70 W/(m·K) Thermal resistance: ＜0.08 ℃·cm²/W Compressibility: ＞50%
Talk To Sales& Tech Support
Frank is Vice President of Sales, Marketing, and Technical Service, based at heatflow Corporation’s global headquarters.
Frank Huang Sales Director 
Sean is expert in thermal simulation and integrated thermal management evaluation
Sean Wang R&D Director, Future Tech 