HPT™ Thermal Interface Materials (TIM)
Our HPT™ series offers high-performance alternatives to global industry leaders (DuPont, Laird, Shin-Etsu).
Liquid Metal Thermal Paste: Delivers ultra-high conductivity (10-16W/m·K) and ultra-low Bond Line Thickness (BLT <15μm) without metal precipitation.
Graphene Thermal Pads: Optimized for high-power GPUs, featuring superior elastic recovery and aging stability.
Specialty Adhesives & Gels: Including room-temperature curing glues and anti-cracking thermal gels.
Reliability Testing
All tests completed over full cycles with no performance degradation:
- High‑temperature aging: 125 °C, 1000 hours
- High temp & high humidity: 85 °C / 85% RH, 1000 hours
- Thermal shock: −40 °C ↔ 125 °C, 1000 cycles
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Applications
- Server CPUs
- Desktop & laptop CPUs
- GPUs & high‑end graphics cards
- Game consoles
- Network & communication equipment
- SoC & ASIC chips
High-Performance Insulator
22$
Thermal Interface Material
22$
Heat Sink Solutions
22$
Cooling Technologies
22$
Custom Thermal Solutions
22$
Talk To Sales& Tech Support
Frank is Vice President of Sales, Marketing, and Technical Service, based at heatflow Corporation’s global headquarters.
Frank Huang Sales Director 
Sean is expert in thermal simulation and integrated thermal management evaluation
Sean Wang R&D Director, Future Tech